Low-temperature co-fired ceramic (LTCC) is an upgraded version of high-temperature co-fired ceramic (HTCC). LTCC is much more cost-effective than HTCC and has firing temperatures in the range of 700-960°C.

The lower fabrication temperature is achieved by the additive manufacturing process of either low melting point glasses or low melting point ceramics. In some cases, adding a combination of both may also result in the same output.

Primary applications of LTCC include resistors, hybrid circuits, transformers, microwaves, inductors, microsystems, and sensors. LTCC has high/low permittivity, low dielectric loss in a single multilayer package, and several multi-functional features by integration and interconnections.

LTCC also offers the highest interconnect density for 3 Dimensional structures as it pre-integrates passives such as capacitors, resistors, and inductors in a single device.

Low temperature cofired ceramic materials can vary based upon their co-firability with metal electrodes. In order to lower the sintering temperature, many different methods have been reported that include reducing the particle size of raw materials, chemical synthesis of raw materials, and the addition of glass or ceramics that have relatively low melting points.

Applications of Low Temperature Co-Fired Ceramics

1. Good heat conduction in extreme temperatures ranging from -100°C to 200°C
2. Long-lasting hermeticity
3. High-frequency stability
4. High dielectric strength
5. Long term stability
6. High mechanical strength
7. High degree miniaturization of electronics
8. Resistance to plasma or ion bombardment

Manufacturing of Low Temperature Co-fired Ceramics

For the production of LTCC, prefabricated foil sheets are used. Holes have to be placed in specific areas depending on the design ordered. The metal pastes are laid on the conductive parts using screen printing methods, and then they are screened onto the green foil backward to form electrical paths.

Green foils are applied to the metal structures in a specified sequence and then sintered between 850 °C-900 °C. The green foils are then pressed onto each other and sintered between 850°C--900°C. Sensitive parts or components can then be applied and fitted. Finally, the LTCC substrates are separated and tested for their functionality.

Low Temperature Co-fired Ceramics Market

The low temperature cofired ceramic market has seen significant growth in recent years. This market comprises LTCC substrate manufacturers, LTCC package producers, LTCC device processing companies, LTCC module makers, and end users. From 1980 onward, the influence of Hughes and DuPont on military systems is said to have positively impacted the evolution of the LTCC technology, revolutionizing the electro-ceramic industry by developing unique products and systems that have changed its ecosystem.

The global low temperature co-fired ceramics market is expected to reach $8,410.7 million by 2031, with a CAGR of 7.6% during the forecast period 2021-2031. The growth of the market is expected to be driven by technological advances in the miniaturization of electronic devices, with a boost from consistent developments in the electronics industry as a whole.

The use of LTCC technology in vehicles is rapidly growing due to the presence of sensors in various parts of the vehicles, such as engines, power transmissions, and hydraulic braking units. These sensors are exposed to high temperatures and harsh operating conditions, impacting their performance when used over a prolonged period. The consequence is an increased number of breakdowns that necessitate the need for this technology to be adopted into cars and trucks.

China has been leading the market in electronics by providing increased demand throughout the supply chain and markets this product globally. There are many companies in each stage of the supply chain and significant global investments concerning research and development (R&D) in China to make it the number one leader in both production and sales.